About
After spending a number of years as a MEMS research engineer in various labs and a decade in financial services, Michael operates as a private investor. Michael holds a PhD degree in Electrical & Electronic Engineering from Imperial College, London, specialising in the field of MEMS - involving the design, fabrication and testing of innovative 3D silicon chips. Part of his work focused on the development of advanced low stress, high bandwidth, self-aligning MEMS RF transmission lines for multi-chip modules. As an offshoot to this work, he developed a novel micro-mechanical interlocking technique to solve a years-long, industry-wide problem of poor adhesion and low production yields in MEMS chips comprising 3D structural elements fabricated in dissimilar materials (especially polymer on Silicon). The technique he developed improved inter-material adhesion to the point where 100% production yields were achievable - a major breakthrough to expand the capabilities of advanced MEMS devices
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- Location
- UK
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